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Jobs Listing

Date Description Type
14 Jul 2014

Product Expert Flip Chip

Product Expert Flip Chip Product requirements (requirement engineering, mainly SW) according market and customer requests for FC applications Support of R&D (internal & external) during project phase (clarification of requirements, specifications, design reviews, etc.) Beta tests of new machines, modules

14 Jul 2014

Mechanical Engineer

Mechanical Engineer Responsible for design/development, analysis, CAD simulation and verification testing of electromechanical components & modules for high speed and high precision equipment Electromechanical module ownership including option, accessories and kits release, reliability enhancement, continuous improvement and production support Formulate

14 Jul 2014

Product Specialist Die Bonder

Product Specialist Die Bonder Responsibilities: Configure and perform detailed product demonstration / onsite evaluation on Die bonder as assigned Answer detailed technical questions from sales, CPM, Service personnel and Customers Maintain an advanced technical understanding of all ESEC die bonder