Lumiere Search
User ID:
Password
Keep me signed in
Forgot Password?
Job Seeker :
Login
|
Register
Job Page
< Back
Print
Process Engineer
Posted Date: 14 Jul 2014
Process Engineer
Responsibilities:
Responsible to liaise with project counterpart in the development of the next generation Flip Chip Bonder machine
To work with key customers in the evaluation and establishment of this new machine technology
Preparation of detailed reports of the project within the given timeline
Presentations of ideas/project status to the project team
Requirements:
Bachelor in Electrical / Electronics / Control Systems / Physics / Chemical
Minimum 2 years’ experience in Semiconductor Packaging Assembly Technology
(Preferably in Flip Chip Bonding)
Ability to understand mechanical drawings
Knowledge in material systems is required
Have prior experience in project management
Independent and self-driven
Ability to provide support when required
We are regret only shortlisted candidate(s) will be notified
Job Summary
Yr(s) of Exp
2
Qualification
Degree
Job Function
Electrical/Electronics Manufacturing
Job Function
Engineering
Zonal Segregation
--
Job Type
Permanent
Cancel this job
Apply Now