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Process EngineerPosted Date: 14 Jul 2014

Process Engineer


  • Responsible to liaise with project counterpart in the development of the next generation Flip Chip Bonder machine
  • To work with key customers in the evaluation and establishment of this new machine technology
  • Preparation of detailed reports of the project within the given timeline
  • Presentations of ideas/project status to the project team
  • Bachelor in Electrical / Electronics / Control Systems / Physics / Chemical
  • Minimum 2 years’ experience in Semiconductor Packaging Assembly Technology(Preferably in Flip Chip Bonding)
  • Ability to understand mechanical drawings
  • Knowledge in material systems is required
  • Have prior experience in project management
  • Independent and self-driven
  • Ability to provide support when required

We are regret only shortlisted candidate(s) will be notified

Job Summary

Yr(s) of Exp 2
Qualification Degree
Job Function
Job Function Engineering
Zonal Segregation --
Job Type