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Product Specialist Die BonderPosted Date: 14 Jul 2014

Product Specialist Die Bonder

Responsibilities:

  • Configure and perform detailed product demonstration / onsite evaluation on Die bonder as assigned
  • Answer detailed technical questions from sales, CPM, Service personnel and Customers
  • Maintain an advanced technical understanding of all ESEC die bonder product and application
  • Coordinate all activities related to technical issues for potential and existing customer
  • Collaborate with D&E and R&D in writing requirements for new features, modifications, etc
  • Ensure all technical requirements appropriately addressed with close follow up with CPM and CSM relating to customer issue
  • Conduct DB product / application training to internal people as well as to customers as needed
  • Coordinate DB software issues; qualify & address it in the main releases
  • Participate in the analysis and definition of new application requirement

Requirements:

  • Masters / Engineering Degree in Mechatronics ,Electronics, Mechanical & Science
  • Broad experiences of 5 years and above on similar capacity in Semiconductor industry
  • Working experience in Die bonding technical service / sales support
  • Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems
  • Hands on experience with automatic, high speed complex equipment

We are regret only shortlisted candidate(s) will be notified

Job Summary

Yr(s) of Exp 5
Qualification Degree
Job Function
Job Function Engineering
Zonal Segregation --
Job Type