Product Specialist Die BonderPosted Date: 14 Jul 2014
Product Specialist Die Bonder
Responsibilities:
- Configure and perform detailed product demonstration / onsite evaluation on Die bonder as assigned
- Answer detailed technical questions from sales, CPM, Service personnel and Customers
- Maintain an advanced technical understanding of all ESEC die bonder product and application
- Coordinate all activities related to technical issues for potential and existing customer
- Collaborate with D&E and R&D in writing requirements for new features, modifications, etc
- Ensure all technical requirements appropriately addressed with close follow up with CPM and CSM relating to customer issue
- Conduct DB product / application training to internal people as well as to customers as needed
- Coordinate DB software issues; qualify & address it in the main releases
- Participate in the analysis and definition of new application requirement
Requirements:
- Masters / Engineering Degree in Mechatronics ,Electronics, Mechanical & Science
- Broad experiences of 5 years and above on similar capacity in Semiconductor industry
- Working experience in Die bonding technical service / sales support
- Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems
- Hands on experience with automatic, high speed complex equipment
We are regret only shortlisted candidate(s) will be notified
Job Summary